Changes for page X0200 - Overview of the CEC Certification Process
Last modified by SuperUwe Trueggelmann on 2025-01-07
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... ... @@ -110,8 +110,34 @@ 110 110 )))| | 111 111 |(% colspan="4" %)2.2.2 Collect Information required to determine the CEC KPIs 112 112 |Send cecLQF| |CEC Administration sends the cecLQF form to the Vendor.|cecLQF 113 +|Enter data in cecLQF|((( 114 +The Vendor enters the following minimum information into the cecLQF: 115 + 116 +* The electricity consumption of the manufacturing site 117 +* The number of products produced in the manufacturing site 118 +* Information about each Layer or main component of the product, at least: 119 +** Supplier 120 +** Type 121 +** Dimensions 122 +** Weight 123 +** Shipping origin and destination, and means of transport 124 + 125 +The cecLQF allows for more detailed information, and providing more detailed information may result in better KPIs, but for Card Bodies, IC Cards, and Antenna Inlays the CEC Administration is usually able to determine sufficient KPIs from the data above. 126 + 127 +For more complicated products such as: 128 + 129 +* IC - Integrated Circuits 130 +* ICM - IC Modules 131 +* Inlays including IC 132 +* Card materials 133 + 134 +please contact the CEC Administration before starting to enter data into the cecLQF. 135 +)))| |((( 136 +cecLQF 137 + 138 +CEC LQF Guidance 139 +))) 113 113 | | | | 114 -| | | | 115 115 |(% colspan="4" %)((( 116 116 = 3. Prepare CEC Assessment Plan = 117 117 )))