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edited by SuperUwe Trueggelmann
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110 110  )))| |
111 111  |(% colspan="4" %)2.2.2 Collect Information required to determine the CEC KPIs
112 112  |Send cecLQF| |CEC Administration sends the cecLQF form to the Vendor.|cecLQF
113 +|Enter data in cecLQF|(((
114 +The Vendor enters the following minimum information into the cecLQF:
115 +
116 +* The electricity consumption of the manufacturing site
117 +* The number of products produced in the manufacturing site
118 +* Information about each Layer or main component of the product, at least:
119 +** Supplier
120 +** Type
121 +** Dimensions
122 +** Weight
123 +** Shipping origin and destination, and means of transport
124 +
125 +The cecLQF allows for more detailed information, and providing more detailed information may result in better KPIs, but for Card Bodies, IC Cards, and Antenna Inlays the CEC Administration is usually able to determine sufficient KPIs from the data above.
126 +
127 +For more complicated products such as:
128 +
129 +* IC - Integrated Circuits
130 +* ICM - IC Modules
131 +* Inlays including IC
132 +* Card materials
133 +
134 +please contact the CEC Administration before starting to enter data into the cecLQF.
135 +)))| |(((
136 +cecLQF
137 +
138 +CEC LQF Guidance
139 +)))
113 113  | | | |
114 -| | | |
115 115  |(% colspan="4" %)(((
116 116  = 3. Prepare CEC Assessment Plan =
117 117  )))
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